Student registration in ‘DiDis’ enhanced June 2023
Student registration in ‘DiDis’ enhanced June 2023 We would like to inform students of the beneficiaries of higher education loans offered by the Higher Education Student Loan Board (HESLB) that the Digital Disbursement Solution (DiDiS) is expected to begin on Tuesday, June 20, 2023, for colleges in Dar es Salaam.
Students at colleges outside Dar es Salaam
For students in higher education institutions located outside Dar es Salaam, registration will take place from June 26, 2023. Further information will be provided through the loan officers at the college and on the Instagram, Twitter and Facebook platforms of HESLB which are available under the name “HESLB Tanzania.”
Improved Didi’s
The Didi’s system used to enroll students has been improved by including the payment of tuition fees directly to the college after a student has admitted to receiving money through the system. In addition, at checkout, for students with a smart phone, they will be able to download the HESLB App and self-serve wherever they are. For students without smartphones, they will receive services through a credit officer present at the college.
The things that a student need
To register, a student must arrive at the registration area of his or her college with a student ID, a bank account number with his or her name and an available phone number registered in his or her name. In addition, HESLB would like to remind students and student governments to cooperate with officials who will conduct the registration exercise as usual.
The number of beneficiaries
The exercise aims to register students who have received a loan for the first time in the 2022/2023 academic year in all higher education institutions in the country. Once registration is complete, all 202,016 college loan beneficiaries will receive funding through Didi’s.
Student registration in ‘DiDis’ enhanced June 2023
Provided by:
- Higher Education Student Loan Board,
- PSSSF Building, Fourth Floor,
- Makole Road,
- P.0.Box 984,
- DODOMA.
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